vishay semiconductors vlmb314. document number 81342 rev. 1.3, 11-sep-07 www.vishay.com 1 standard smd led plcc-2 description this device has been designed to meet the increasing demand for ingan technology. the package of the vlmb314.-series is the plcc-2. it consists of a lead frame which is embedded in a white thermoplast. the reflector inside this package is filled up with clear epoxy. features ? smd led with exceptional brightness ? luminous intensity categorized ? compatible with automatic placement equipment ? eia and ice standard package ? compatible with ir reflow, vapor phase and wave solder processes according to cecc 00802 and j-std-020c ? available in 8 mm tape ? low profile package ? non-diffused lens: exce llent for coupling to light pipes and backlighting ? low power consumption ? luminous intensity ratio in one packaging unit i vmax /i vmin 1.6 ? lead (pb)-free device ? preconditioning: acco rding to jedec level 2a ? esd-withstand voltage: up to 1 kv according to jesd22-a114-b ? component in accordance to rohs 2002/95/ec and weee 2002/96/ec 19225 e3 product group and package data ? product group: led ? package: smd plcc-2 ? product series: standard ? angle of half intensity: 60 applications ? automotive: backlighting in dashboards and switches ? telecommunication: indicator and backlighting in telephone and fax ? indicator and backlight for audio and video equipment ? indicator and backlight in office equipment ? flat backlight for lcds , switches and symbols ? general use parts table part color, luminous intensity technology vlmb314p2r1-gs08 blue, i v = (56 to 140) mcd ingan on sic vlmb314p2r1-gs18 blue, i v = (56 to 140) mcd ingan on sic vlmb314q2s1-gs08 blue, i v = (90 to 224) mcd ingan on sic vlmb314q2s1-gs18 blue, i v = (90 to 224) mcd ingan on sic vlmb314p2s1-gs08 blue, i v = (56 to 224) mcd ingan on sic VLMB314P2S1-GS18 blue, i v = (56 to 224) mcd ingan on sic
www.vishay.com 2 document number 81342 rev. 1.3, 11-sep-07 vishay semiconductors vlmb314. note: 1) t amb = 25 c, unless otherwise specified 2) driving led in reverse direction is suitable for short term application note: 1) t amb = 25 c, unless otherwise specified 2) in one packing unit i vmax /i vmin 1.6 note: luminous intensity is tested at a current pulse duration of 25 ms and an accuracy of 11 %. the above type numbers represent the order groups which include only a few brightness groups. only one group will be shipped on each reel (there will be no mixi ng of two groups on each reel). in order to ensure avai lability, single brightnes s groups will not be orderable. in a similar manner for colors where wavelength groups are measured and binned, single wavelength groups will be shipped on any one reel. in order to ensure availability, single wavelength groups will not be orderable. note: wavelengths are tested at a current pulse duration of 25 ms and an accuracy of 1 nm. absolute maximum ratings 1) vlmb314. parameter test condition symbol value unit reverse voltage 2) v r 5v dc forward current t amb 80 c i f 20 ma surge forward current t p 10 s i fsm 0.2 a power dissipation p v 84 mw junction temperature t j 110 c operating temperature range t amb - 40 to + 100 c storage temperature range t stg - 40 to + 100 c thermal resistance junction/ ambient mounted on pc board (pad size > 16 mm 2 ) r thja 350 k/w optical and electrical characteristics 1) vlmb314., blue parameter test condition pa rt symbol min typ max unit luminous intensity 2) i f = 20 ma vlmb314p2r1 i v 56 140 mcd vlmb314q2s1 i v 90 224 mcd vlmb314p2s1 i v 56 224 mcd dominant wavelength i f = 20 ma d 462 476 nm peak wavelength i f = 20 ma p 464 nm angle of half intensity i f = 20 ma ? 60 deg forward voltage i f = 20 ma v f 34.2v reverse voltage i r = 10 a v r 5v temperature coefficient of v f i f = 20 ma tc v - 4 mv/k temperature coefficient of i v i f = 20 ma tc i - 0.4 %/k luminous intensity classification group light intensity (mcd) standard optional min max p 2 56 71 q 1 71 90 2 90 112 r 1 112 140 2 140 180 s 1 180 224 color classification group blue dom. wavelength (nm) min. max. 3 462 468 4 466 472 5 470 476 crossing table vishay osram vlmb314p2r1 lbt67c-p2r1 vlmb314p2s1 lbt67c-p2s1 vlmb314q2s1 lbt67c-q2s1
document number 81342 rev. 1.3, 11-sep-07 www.vishay.com 3 vishay semiconductors vlmb314. typical characteristics t amb = 25 c, unless otherwise specified figure 1. forward current vs. ambient temperature for ingan figure 2. relative luminous intensity figure 3. relative intensity vs. wavelength 0 5 10 15 20 25 0 t am b - am b ient temperat u re (c) 16 8 06 i f - for w ard c u rrent (ma) 10 20 30 40 50 60 70 8 0 110 100 90 0.4 0.2 0 0.2 0.4 0.6 95 10319 0.6 0.9 0. 8 0 30 10 20 40 50 60 70 8 0 0.7 1.0 i v rel - relati v e l u mino u s intensity 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0. 8 0.9 1.0 1.1 1.2 400 420 440 460 4 8 0 500 520 540 560 - w a v elength (nm) 16069 i v rel - relati v e l u mino u s intensity b l u e figure 4. forward current vs. forward voltage figure 5. specific luminous flux vs. forward current figure 6. dominant wavelength vs. forward current 0 10 20 30 40 50 60 70 8 0 90 100 2.0 2.5 3.0 3.5 4.0 4.5 5.0 v f - for w ard v oltage ( v ) 1991 8 i f - for w ard c u rrent (ma) 0.01 0.1 1 10 1 10 100 i f - for w ard c u rrent (ma) 16194 i - relati v e l u mino u s intensity v rel i f - for w ard c u rrent (ma) 16 8 14 dominant w a v elength (nm) 46 8 470 472 474 476 0 1020304050 b l u e
www.vishay.com 4 document number 81342 rev. 1.3, 11-sep-07 vishay semiconductors vlmb314. package dimensions in millimeters method of taping/polarity and tape and reel smd led (vlm3 - series) vishay?s leds in smd packages are available in an antistatic 8 mm blister tape (in accordance with din iec 40 (co) 564) for automatic component insertion. the blister ta pe is a plastic strip with impressed component cavities, covered by a top tape. taping of vlm.3.. 95 11314-1 mounting pad layout 3.5 0.2 0.9 1.75 0.10 pin identification 2. 8 + 0.15 2.2 ? 2.4 3 + 0.15 1.2 2.6 (2. 8 ) 1.6 (1.9) 4 4 area co v ered w ith solder resist technical dra w ings according to di n specifications dra w ing- n o.: 6.541-5025.01-4 iss u e: 8 ; 22.11.05 ca adhesi v e t ape component ca v ity blister t ape 94 8 670 figure 7. tape dimensions in mm for plcc-2 1. 8 5 1.65 4.0 3.6 3.6 3.4 2.05 1.95 1.6 1.4 4.1 3.9 4.1 3.9 5.75 5.25 8 .3 7.7 3.5 3.1 2.2 2.0 0.25 94 8 66 8
document number 81342 rev. 1.3, 11-sep-07 www.vishay.com 5 vishay semiconductors vlmb314. reel package dimension in mm for smd leds, tape option gs08 (= 1500 pcs.) reel package dimension in mm for smd leds, tape option gs18 (= 8000 pcs.) preferred soldering profile bar code product label example: a) type of component b) manufacturing plant c) sel - selection code (bin): e.g.: p2 = code for luminous intensity group 3 = code for color group d) date code year/week e) day code (e.g. 2: tuesday) f) batch no. g) total quantity h) company code figure 8. reel dimensions - gs08 figure 9. reel dimensions - gs18 figure 10. vishay lead (pb)-free reflow soldering profile (acc. to j-std-020c) 1 8 0 17 8 identification 4.5 3.5 2.5 1.5 13.00 12.75 63.5 60.5 14.4 max. 10.0 9.0 120 94 8 665 la b el: v ishay type gro u p tape code prod u ction code q u antity 321 329 identification 4.5 3.5 2.5 1.5 13.00 12.75 62.5 60.0 14.4 max. 10.4 8 .4 120 1 88 57 la b el: v ishay type gro u p tape code prod u ction code q u antity 0 50 100 150 200 250 300 0 50 100 150 200 250 300 time (s) temperat u re (c) 240 c 245 c max. 260 c max. 120 s max. 100 s 217 c max. 30 s max. ramp u p 3 c/s max. ramp do w n 6 c/s 19 88 5 ir reflo w soldering profile for lead (p b )-free soldering preconditioning acc. to jedec le v el 2a max. 2 cycles allo w ed 255 c figure 11. double wave soldering of opto devices (all packages) 235 c...260 c 2 k/s ca. 200 k/s ca. 2 k/s second w a v e first w a v e ca. 5 k/s 5 s f u ll line: typical dotted line: process limits time (s) temperat u re (c) lead temp erat u re 300 250 200 150 100 50 0 0 100 150 200 250 94 8 626-1 tt w soldering (acc. to cecc00 8 02) 50 100 c...130 c forced cooling 106 37 v ishay a h bc d e f g 20147
www.vishay.com 6 document number 81342 rev. 1.3, 11-sep-07 vishay semiconductors vlmb314. dry packing the reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transportation and storage. final packing the sealed reel is packed into a cardboard box. a secondary cardboard box is used for shipping purposes. recommended method of storage dry box storage is recommended as soon as the aluminum bag has been opened to prevent moisture absorption. the following conditions should be observed, if dry boxes are not available: ? storage temperature 10 c to 30 c ? storage humidity 60 % rh max. after more than 672 h under these conditions moisture content will be too high for reflow soldering. in case of moisture absorpt ion, the devices will recover to the former condition by drying under the following condition: 192 h at 40 c + 5 c/- 0 c and < 5 % rh (dry air/ nitrogen) or 96 hat 60 c + 5 c and < 5 % rh for all device containers or 24 hat 100 c + 5 c not suitable for reel or tubes. an eia jedec standard j esd22-a112 level 2a label is included on all dry bags. example of jesd22-a112 level 2a label esd precaution proper storage and handling procedures should be followed to prevent esd damage to the devices especially when they are removed from the antistatic shielding bag. electro-static sensitive devices warning labels are on the packaging. vishay semiconductors standard bar code labels the vishay semiconductors standard bar code labels are printed at final packing areas. the labels are on each packing unit and contain vishay semiconductors specific data. al u min u m b ag la b el reel 15973 l e v e l caution this bag contains moisture ? sensitive devices 1. shelf life in sealed bag 12 months at <40c and < 90% relative humidity (rh) 2. after this bag is opened devices that will be subjected to infrared reflow, vapor - phase reflow, or equivalent processing (peak package body temp. 260c) must be: a) mounted within 672 hours at factory condition of < 30c/60%rh or b) stored at <1 0% rh. 3. devices require baking before mounting if: a) humidity indicator card is >10% when read at 23c + 5c or b) 2a or 2b is not met. 4. if baking is required, devices may be baked for: 192 hours at 40c + 5c/ - 0c and <5%rh (dry air/nitrogen) or 96 hours at 605 o cand <5%rh for all device containers or 24 hours at 1005c not suitable for reels or tubes bag seal date: ______________________________ (if blank, see bar code label) note: level defined by eia jedec standard jesd22 - a113 2a 197 8 6
vishay semiconductors vlmb314. document number 81342 rev. 1.3, 11-sep-07 www.vishay.com 7 ozone depleting substa nces policy statement it is the policy of vishay semiconductor gmbh to 1. meet all present and future national and international statutory requirements. 2. regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. it is particular concern to control or eliminate releases of those substances into t he atmosphere which are known as ozone depleting substances (odss). the montreal protocol (1987) and its london amendments (1990) intend to severely restrict the use of odss and forbid their use within the next ten years. various national and international initiatives are pressing for an earlier ban on these substances. vishay semiconductor gmbh has been able to use its polic y of continuous improvements to eliminate the use of odss listed in the following documents. 1. annex a, b and list of transitional substances of the montreal protocol and the london amendments respectively 2. class i and ii ozone depleting substances in the clean air act amendments of 1990 by the environmental protection agency (epa) in the usa 3. council decision 88/540/eec and 91/690/eec annex a, b and c (transitional substances) respectively. vishay semiconductor gmbh can certify that our semico nductors are not manufactured with ozone depleting substances and do not contain such substances. we reserve the right to make c hanges to improve technical design and may do so without further notice. parameters can vary in different applications. all operat ing parameters must be validated for each customer application by the customer. should the buyer use vish ay semiconductors products for any unintended or unauthorized application, the buyer shall indemnify vishay semiconductors against all claims, costs, damages, and expenses, arising out of, directly or i ndirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. vishay semiconductor gmbh, p.o.b. 3535, d-74025 heilbronn, germany
document number: 91000 www.vishay.com revision: 18-jul-08 1 disclaimer legal disclaimer notice vishay all product specifications and data are subject to change without notice. vishay intertechnology, inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, ?vishay?), disclaim any and all liability fo r any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. vishay disclaims any and all li ability arising out of the use or application of any product describ ed herein or of any information provided herein to the maximum extent permit ted by law. the product specifications do not expand or otherwise modify vishay?s terms and conditions of purcha se, including but not limited to the warranty expressed therein, which apply to these products. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of vishay. the products shown herein are not designed for use in medi cal, life-saving, or life-sustaining applications unless otherwise expressly indicated. customers using or selling vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify vishay for any damages arising or resulting from such use or sale. please contact authorized vishay personnel to obtain written terms and conditions regarding products designed for such applications. product names and markings noted herein may be trademarks of their respective owners.
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